Semiconductor Engineering17h
Energy Analysis: 2D and 3D Architectures with Systolic Arrays and CIM (Cornell)
Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In this paper, we investigate digital CIM (DCIM) ...
Semiconductor Engineering17h
Review of Automatic EM Image Algorithms for Semiconductor Defect Inspection (KU Leuven, Imec)
A new technical paper titled “Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A ...
Semiconductor Engineering18h
Research Bits: Oct. 22
D-printed active electronics; edible toothpaste-based transistor; solution deposition for large-scale electronics.
Semiconductor Engineering1d
Increasing Design Flexibility With RISC-V-Based Processor IP
The semiconductor industry increasingly needs more flexible and scalable processor architectures, driving the growing ...
Semiconductor Engineering1d
Reactionary Or Anticipatory?
Is EDA meant to react to the needs of the industry, or anticipate its needs and develop ahead of the curve? The balance point ...
Semiconductor Engineering1d
LLMs Show Promise In Secure IC Design
LLMs require a secure environment As with any LLM, a hardware-security oriented program can only generate results as good as ...
Semiconductor Engineering3d
Mini Review of Photodetectors and Image Sensors: Materials and Fabrication
A new technical paper titled “Image Sensors and Photodetectors Based on Low-Carbon Footprint Solution-Processed ...
Semiconductor Engineering5d
Distributed Radar Signal Processing Utilizing A Sparse Array To Obfuscate The Data
A new technical paper titled “Signal processing architecture for a trustworthy 77GHz MIMO Radar” was published by researchers ...
Semiconductor Engineering5d
Physics-Based Efficient Device Model for Fe-TFTs (Univ. of Florida)
A new technical paper titled “An efficient device model for ferroelectric thin-film transistors” was published by researchers ...
Semiconductor Engineering5d
3D-Printed Logic Gates and Resettable Fuses, Via Material Extrusion (MIT)
A new technical paper titled “Semiconductor-free, monolithically 3D-printed logic gates and resettable fuses” was published ...
Semiconductor Engineering5d
GPUs: Bandit Based Framework To Dynamically Reduce Energy Consumption
A new technical paper titled “Online Energy Optimization in GPUs: A Multi-Armed Bandit Approach” was published by researchers ...
Semiconductor Engineering5d
Cloud Or On-premises? Why Not Both: A Hybrid Approach For Structure Simulation
After all, a cloud computing model enables you to access the most advanced, leading-edge software and hardware on demand. There are no queues or wait times. Users can “dial up” core counts and other ...