A new technical paper titled “Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A ...

Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In this paper, we investigate digital CIM (DCIM) ...

D-printed active electronics; edible toothpaste-based transistor; solution deposition for large-scale electronics.

LLMs require a secure environment As with any LLM, a hardware-security oriented program can only generate results as good as ...

The semiconductor industry increasingly needs more flexible and scalable processor architectures, driving the growing ...

Is EDA meant to react to the needs of the industry, or anticipate its needs and develop ahead of the curve? The balance point ...

The number of approaches to process AI inferencing is widening to deal with unique applications and larger and more complex ...

A new technical paper titled “Signal processing architecture for a trustworthy 77GHz MIMO Radar” was published by researchers ...

Synopsys 3DIO IP Solution (figure 4) is specially tuned for multi-die heterogeneous integration with a versatile offering, ...

The shift toward heterogeneous integration and advanced packaging have changed the dynamics of mixed-signal design — and ...

A new technical paper titled “Image Sensors and Photodetectors Based on Low-Carbon Footprint Solution-Processed ...

Liquid cooling in the data center is just that—cooling technology that uses liquid to remove heat from the chip without using ...